Today we'll be looking at ChipQuik Inc's low-temperature rework alloy (known simply as "ChipQuik"), a god-send for SMD removal/repair both on and off the field!
ChipQuik is essentially an alloy containing Bismuth as its main constituent, which in-itself has an inherently low melting point. Once the alloy is heated and combined with standard Tin/Lead or Lead-Free solder, the overall melting point drops dramatically to just under 60oC (as opposed to the typical 180~200oC for tin-lead)
This in-turn means the solder will remain molten (or at least, malleable) for a longer period of time, allowing you to perform extensive repairs to both through-hole and SMD boards without the need for specialised equipment. It also minimises the possibility of damaging the PCB substrate, solder mask, pads or surrounding components due to heat-related stress
For the sake of simplicity, we'll be removing a small 20-pin SSOP package (an AC'97 codec) from an old XBOX mainboard. The same process can easily be used on larger components with a higher pin density (ie: TQFP144) after you've had some practice.
Here is our target:
We'll be using the following tools and consumables:
We're now ready to begin! Due to the extremely low melting point of the alloy, it may be a good idea to turn down your 'irons heat setting (thank to Grant of UltraLogic For the tip!)
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